M66 R2.0 is an ultra-compact quad-band GSM/GRPS module using LCC castellation packaging.
Based on the latest 2G chipset,it has the optimal performance in SMS & data transmission and audio service even in harsh environment.
The highly compact17.7mm × 15.8mm × 2.3mm profile makes it a perfect selection for size sensitive applications.M66 R2.0 adopts surface mounted technology, making it an ideal solution for durable and rugged designs.
The low profileand small size of LCC package ensure it can be easily embedded into size-constrained applications, and provides reliableconnectivity with applications.
This kind of package is ideally suited for large-scale manufacturing which has strictrequirements for cost and efficiency.
The compact form factor, low power consumption and extended temperature range make M66 R2.0 a best choice for M2Mapplications such as wearable devices, automotive, industrial PDA, personal tracking, wireless POS, smart metering,telematics, and so on.